Technical Program

Paper Detail

Paper:WP.L4.1
Session:Hardware for Image Processing
Time:14:20 - 14:40
Presentation: Oral
Topic: Electronic Imaging: ELI-HDW
Title: HIGH-THROUGHPUT INTERPOLATION HARDWARE ARCHITECTURE WITH COARSE-GRAINED RECONFIGURABLE DATAPATHS FOR HEVC
Authors: Cláudio Machado Diniz; Karlsruhe Institute of Technology (KIT) and Federal University of Rio Grande do Sul (UFRGS) 
 Muhammad Shafique; Karlsruhe Institute of Technology (KIT) 
 Sergio Bampi; Federal University of Rio Grande do Sul 
 Jörg Henkel; Karlsruhe Institute of Technology (KIT)